BAE Systems has entered into a strategic partnership with 3D Plus, the leading company for 3D electronics packaging in Europe, to deliver bespoke 3D System-In-Package solutions enabling the achievement of new levels of performance, flexibility and development time for its electronics solutions.
Announcing the partnership with 3D Plus, James Baker, Director and General Manager of BAE Systems Advanced Technology Centre stated,
“With the increasing demand for improved electronics performance across industries and markets, we are delighted to announce our partnership with one of Europe’s leading innovators in electronics technologies to deliver the next generation of packaging solutions. The partnership will enable us to bring together a unique set of research, design, development and manufacturing skills to address these performance demands.”
For 3D Plus, President, Dr Christian Val embraced the partnership approach with BAE Systems, “We are proud to partner with a global leader such as BAE Systems in order to promote our outstanding technology for new applications such as avionics, automotive, medical or consumer electronics”.
The growing demand across industries to deliver higher levels of integration, lower costs and reduced time to market is driving the growth in system-in-package solutions. With a proven pedigree in advanced 2D, 2½D and 3D electronic packaging solutions, the partnership offers a unique set of design skills, methodologies and knowledge to deliver the next generation in 3D packaged solutions.
The new design and manufacturing service recognises the different balance of drivers across markets for the adoption of high density packaging – such as size, speed, robustness, time to market and cost. Delivering reductions in size, weight and cost of 75%, 80% and 30% respectively, CirCube™, the integrated design and development capability, offers a range of services that can be tailored to meet a customer’s specific requirements.
